 |
|
| Processor board |
Processor cores: 2-4
Chipset: HP zx2
System bus bandwidth: 8.5 GB/s |
| Dual-core processor modules |
Type: Dual-core Intel® Itanium® processor
1.42 GHz/12 MB Dual-core (9120N)
1.66 GHz/18 MB Dual-core (9140M)
Level 1 cache: 32 KB
Level 2 cache: 1 MB instruction/256 KB data
Level 3 cache: 12 MB (6 MB per core) and 18 MB (9 MB per core) |
| Main memory |
Bus bandwidth: 12.8 GB/s
RAM type: PC2-4200 ECC chip spare DDR2
Capacity: 192 GB maximum
Memory slots: 24 DIMM slots |
| Operating systems |
HP-UX 11i v2 and v3 with HP Virtual Server Environment (choice of Mission-Critical, Enterprise, Technical Computing, or Foundation Operating Environment);
Windows Server 2008 for Intel Itanium-based systems; Red Hat Enterprise Linux 4 and 5 and Novell SUSE Linux Enterprise Server 10 and 11;
OpenVMS v8.3 (choice of Mission Critical, Enterprise, or Foundation Operating Environment)
|
|
| Internal storage devices |
Internal hard drive bays: 8 Serial Attached SCSI small form factor (SFF) 2.5 inch drives
Disk offerings: 36 GB, 72 GB, 146 GB & 300 GB
Maximum storage: 2.4 TB Removable media: 1 open bay for DVD |
| Expansion slots |
Choice of Backplanes: All PCI-X backplane, 8 PCI-X slots (I/O bandwidth 8.0 GB/s) or
PCI EXPRESS Backplane, 4 PCI EXPRESS slots and 4 PCI-X slots (I/O bandwidth 9.8 GB/s)
|
|
| Core I/O and management processor interconnect |
2 x Gigabit Ethernet
10/100Base-T LAN for Integrated Lights Out 2 (iLO2) management
1 RS-232 serial port for general use, and 2 RS-232 serial ports
VGA (required for Windows, optional for HP-UX, Linux, and OpenVMS)
3 USB ports for local human interface
|
|
| Environmental specifications |
|
| Altitude |
Operating: 3000 m (10,000 ft) maximum
Non-operating: 4600 m (15,000 ft) maximum |
| Temperature (Celsius and Fahrenheit) |
Operating: +5°C to +35°C (+41°F to +95° F)
Non-operating: −40°C to +70°C (−40°F to +158°F)Maximum rate of temperature change: 36°F (20°C) per hour
|
|
| Humidity |
Operating: 15% to 80% relative non-condensing
Non-operating: 8% to 85% non-condensing
|
|
| Physical dimensions (Rack form factor) |
Height: 6.8 in. (173 mm)/4U EIA
Width: 17.32 in. (440 mm)
Depth: 27.4 in. (696 mm)
|
|
| Physical dimensions (Standalone frame) |
Height: 20.2 in. (512 mm)
Width: 8.5 in. without feet, 14.5 in. with feet (216 mm without feet, 369 mm with feet)
Depth: 27.4 in. (696 mm)
|
|
| Net weight |
Maximum configuration (racked): 99 lb. (45 kg)Maximum configuration (pedestal version): 114 lb. (52 kg)
|
|
| Power requirements |
Maximum input current: 14 A @ 100 VAC
Line frequency: 50–60 Hz
Maximum AC power input: 1,095 W
Note: Power figures are per system, not per input line (power supply), and include losses in the power supplies.
|
|
| Power supply |
Maximum output 1200 W |
| Regulatory |
Regulatory model number: RSVLA-0404 |
| Intel and Itanium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Microsoft and Windows are U.S. registered trademarks of Microsoft Corp. Linux is a U.S. registered trademark of Linus Torvalds. |
|
|
|
|
Printable version
